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IDProjectCategoryView StatusLast Update
0001177K18X001.00 SKB SWANHWpublic2022-01-03 09:22
Reporter(ALTech) SH Son Assigned To(HW) Sean Chiang Due Date
PrioritynormalSeveritys4-minorReproducibilityhave not tried
Status closedResolutionfixed 
Summary0001177: [SWAN] MIC Sealing test
Descriptionneed to update Mic sealing condition and find the Mic sealing condition for meet the customer spec.
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Users monitoring this issue

User List (ALTech) BY Lee , (ALTech) JW Kim , (ALTech) Lonnie Kim , (ALTech) Philip , (ALTech) SB Park , (ALTech) SH Son , (ALTech) SY Yoon , (HW) Catherine Chen , (HW) Sean Chiang , (HW) Tom Lee , (ME) Daniel Hu , (PM) Henry Chiou , (PM) Sheila Tu , (PM) Tiffanie Lai , (RD) Fu-chiang Young , (RD) Jay Lin , (RD) Jim Chen

Activities

(ALTech) SH Son

2021-03-23 17:12

developer   ~0006487

Korea (Inkel) lab test result

(ALTech) SH Son

2021-03-24 10:05

developer   ~0006495

Fii test report upload
RE_ _SWAN_DVT Test plan.msg (5,984,768 bytes)

(ALTech) SH Son

2021-04-01 15:02

developer   ~0006553

Fii additional test report updated.

(ALTech) SH Son

2021-04-02 16:55

developer   ~0006561

3/29 Korea lab test result

(RD) Fu-chiang Young

2021-04-06 15:02    private

developer   ~0006579

Last edited: 2021-04-06 15:13

(RD) Fu-chiang Young

2021-04-07 19:48

developer   ~0006621

Last edited: 2021-04-08 10:56

Hi SH,
Update the test environment as attached file.

Thank you.

(RD) Fu-chiang Young

2021-04-13 10:39

developer   ~0006676

Hi SH,
Will provide new sponge_mic_silicon rubber 1.1t without pcb side o-ring for us to test?
When is ETA?

For DVT3, the label of mic board has been changed and components need to move.
Also will provide latest version silicon_mic rubber for us to test on DVT3 build?

Thank you.

(ALTech) SH Son

2021-04-20 10:18

developer   ~0006772

HI Fu-chiang Young
  0001177:0006676
for DVT3 sponge_mic_silicon rubber : 1.1t without pcb side o-ring
and DVT3 silicon Mic : as Fii designed

is being delivered.
Please test and verify.
about components move DVT3 Mic due to label, I want to use it without modification DVT3 silicon Mic in DVT.

if you have any question, please let me know

Thanks
SON

(RD) Fu-chiang Young

2021-04-28 14:43    private

developer   ~0006912

Last edited: 2021-04-28 14:48

(RD) Fu-chiang Young

2021-04-28 14:48

developer   ~0006913

Hi SH,
We received the rubber yesterday(4/27), and will arrange to test on Tuesday(4/29).
For silicon_mic rubber, will that use non-modification for DVT3?

Let's test and see the test results.

Thank you.

(RD) Fu-chiang Young

2021-04-29 14:19

developer   ~0006945

Hi SH,
We test the new rubber, but the test results are fail.
Please see the attached report.

By the way, how about the test result last time Henry sent you the golden top cover?

Thank you.

(RD) Fu-chiang Young

2021-04-30 19:57    private

developer   ~0006966

Last edited: 2021-04-30 19:58

(RD) Fu-chiang Young

2021-04-30 19:58

developer   ~0006967

Hi SH,

As our internal discussion, we might hope to see the test results for DVT3 new rubber solution which were as sent to us.
And also help to verify the golden top cover.
We found our test environment has a little bit different as your environment.
Maybe the sweep source needs to put at the edge of the desk for reduce the reflection and move test sample closer to sweep source to make sure with 94dBSPL.

Thank you.

(ALTech) SH Son

2021-05-20 09:48

developer   ~0007176

Hi Fu-chiang Young
reply 0001177:0006967
I know the a little bit different as your environment.
and checked same trend FII test result and ALT test result DVT3 rubber and Fii golden top cover 0001177:0006945

So, will prepare same conditions Fii golden top cover
questions.
 1. checked the golden top cover conditions
   a. sponge mic silicon : 0.5t thickness
   : double side O-ring ? or one side(top houding side) O-ring?
    The O-ring did not significantly affect the results. I think top houding side O-ring seems to have better tape adhesion.
   b. adhesive tape : 0.2t thickness
   c. silicon Mic : add 0.9mm back side
 
 2. update the technical datasheet adhesive tape
  : I will discuss with Inkel to assembled adhesive tape to sponge mic silicon
 
Thanks
SON

(RD) Fu-chiang Young

2021-05-20 10:22

developer   ~0007178

Hi SH,
Update the information:

questions.
 1. checked the golden top cover conditions
   a. sponge mic silicon : 0.5t thickness
   : double side O-ring ? or one side(top houding side) O-ring?
   Fuchiang: It is double side O-ring, the hole of the adhesive is smaller than O-ring.

    The O-ring did not significantly affect the results. I think top houding side O-ring seems to have better tape adhesion.
   b. adhesive tape : 0.2t thickness
   c. silicon Mic : add 0.9mm back side
   Fuchiang: Yes, b and c points are correct.
                     In our testing, O-ring can be cancelled on PCB side. Mic vendor suggests us to paste the adhesive on PCB side can provide more sealing.
                     Because the PCB has many via and the PCB is not smooth. The adhesive may be a good solution for sealing.
 
 2. update the technical datasheet adhesive tape
  : I will discuss with Inkel to assembled adhesive tape to sponge mic silicon
   Fuchiang: ME has no datasheet currently. The adhesive is 3M and thickness is 0.2mm.

Thank you.

(RD) Fu-chiang Young

2021-05-21 11:14

developer   ~0007198

Hi SH,

Update the 3M adhesive datasheet.

Thank you.

(ALTech) SH Son

2021-05-24 10:47

developer   ~0007210

HI Sean.
Here is Korea lab test result updated.
and about Adhesive tape between PCBA and housing
• Fii need to review that Adhesive tape apply on the MIC PCBA

please see the attached test report.

Thanks
SON

(HW) Sean Chiang

2021-05-25 12:56

developer   ~0007221

Hi SH,

Please see my comment about the next plan of your report. Thanks!
1. About the rubber design, Fii verified the double-sided O-ring in DVT stage because we only received double-sided sample at that time. Although the result is good but we think the single-sided is more suitable for assembly between PCB and rubber. Can you also make a single-sided o-ring rubber sample for further verification?
2. About the adhesive tape between PCBA and rubber, ME Jim will evaluate that with factory engineer and get back to you by this Thursday.

Regards,
Sean

(ALTech) SH Son

2021-05-25 14:49

developer   ~0007222

Last edited: 2021-05-25 14:50

HI Sean
0001177:0007221

1. Let me know final FII request O-ring design within today.
as my test result, the O ring (double side or single side) does not have a significant effect on the results.
I think single side O ring(housing side) is enough to FII's "sponge mic silicon" design purpose.
we have to consider attached adhesive and assembly.

2. Please find the adhesive tape design from Inkel ME.

Thank
SON

(HW) Sean Chiang

2021-05-25 18:30

developer   ~0007225

Hi SH,

1. OK. I agreed with you. Please prepare single-sided sponge_silicon_MIC for us.
2. Got it. We will check it.

Thanks,
Regards,
Sean

(HW) Sean Chiang

2021-06-08 16:42

developer   ~0007396

Hi SH,

We have asked two vendors to prepare adhesive tape samples for us.
One of vendor called MeiGaoMei that has sent out 40pcs samples to you yesterday. Please refer the tracking number as below,
Will provide you another track number once we get the infomation from vendor. Thanks!

Vendor name: MeiGao Mei,
Track number: SF1123316896372 (Express: SF EXPRESS)

Regards,
Sean

(ALTech) SH Son

2021-06-14 16:06

developer   ~0007457

Hi Sean and Jim

I received adhesive tape samples. - MeiGaoMei , shenzhen everything industrial
Both adhesive tapes are little bit larger than the MIC PCBA, but assembly is not a problem.
I checked the top housing assembly, will be no problem.
but, the adhesive tape should be attached MIC PCBA side first.
 - Please confirm the adhesive tapes sub assembly proceed at VN factory.

I will update the MIC sealing performance result.

Thanks
SON

(ALTech) SH Son

2021-06-24 10:58

developer   ~0007547

Hi Sean

Here is new rubber test report at korea lab
the result is pass.
Please refer to the attachment report

Thanks
SON

(HW) Sean Chiang

2021-06-24 11:34

developer   ~0007548

Hi SH,

Thanks for the report.
Can you confirm that the MIC Silicon rubber you are testing is double-sided or single-sided o-ring?


Thanks,
Regards,
Sean

(ALTech) SH Son

2021-06-24 14:41

developer   ~0007549

Hi Sean

I tested single-sided o-ring.

and the rubber sample send to FII today
Fedex : 7740 8555 8444

The other rubber sample will send with T1 housing sample

Thanks
SON

(ALTech) SH Son

2021-09-27 16:28

developer   ~0008308

Hi Sean

Please let us know the below vender contact point and MPN.
  MeiGaoMei ,
  shenzhen everything industrial

ALT is under review the adhesive tape order directly,
Please let me know if you have any problems.

Thanks
SON

(PM) Sheila Tu

2021-10-12 20:04

developer   ~0008423

Hi SH,

I've explained in weekly meeting that our RD doesn't have the vendor's contact information because these kinds of materials are controlled by our purchase team.
After the discussion with our purchase team, they refuse to provide the information because the contact window on vendor site for ALT won't be the same as Fii's.
As an alternative plan, please refer to the attached drawing and the below link.
You could find their official contact information on their website.

MeiGaoMei : http://www.meigaom.com/home.html
shenzhen everything industrial: https://www.eti-print.com/

(ALTech) SH Son

2021-10-13 10:08

developer   ~0008426

Hi Sheila Tu
the drawings is missing.
before contact the vender, I dont know final drawing and MPN.
Please upload the final drawings and MPN


Thanks
SON

(PM) Sheila Tu

2021-10-13 11:00

developer   ~0008433

Hi SH,

Sorry to miss the drawing. Please find the attachment.
* There is no MPN in this material because it's customized material by Fii.
You could use the drawing to check with vendors.
adhesive_double.pdf (271,538 bytes)

(ALTech) SH Son

2021-10-20 15:26

developer   ~0008509

Sheila Tu
 0001177:0008433

IF ALT is order the adhesive tape directly, How do I send it to the factory?
please let us know the FII PN

also, It is a material that must be used in the next production. Can you check the factory the stock status?

Thanks
SON

(PM) Sheila Tu

2021-10-20 17:54

developer   ~0008515

Hi SH,

Our RD did apply P/N in adavance.
Fii P/N: 481.00620.005LT

So far we have 7.4K in stock and 4.6K OPO that the vendor doesn't agree to cancel.
If ALT agrees to assembly it then ship it out to Fii, we could change the material by running change to prevent idle material.

(ALTech) SY Yoon

2021-10-21 11:00

developer   ~0008524

Hi Ms. Sheila Tu,

We were trying to find another solution instead of "double side acetic tape" for MIC sealing.
As you know, double side acetic tape cannot attach on Sponge_mic_Silicon.
So we would like to remove and change thickness of Sponge_Mic_Silicon.
But test result was fail.
So we should keep using "double side acetic tape" for mic sealing.
If you have any concern to keep using "double side acetic tape", please let us know.

(PM) Sheila Tu

2021-10-21 12:10

developer   ~0008527

Hi Mr. Yoon,

The purpose of "double side acetic tape" is to prevent interstice between PCBA and Sponge_mic_Silicon.
We think you could refer to the adhesive on 4000-21105-500-0V instead of "double side acetic tape".
I attached the picture for your reference.

(ALTech) SY Yoon

2021-10-21 15:05

developer   ~0008532

Hi Ms. Sheila Tu,

We tried to attach Sponge_Mic_Silicon on Rubber foot adhesive tape.
Sponge_Mic_Silicon cannot be attached on Rubber foot.
It is same situation that "double side acetic tape" cannot attach on Sponge_Mic_Silicon.
I think you can try.
And if we changed the material for sealing, then we arrange the test Lab that SKT designated.
Test cost is more higher than cost of 10K pcs of double side acetic tape.
It is not included our labor cost.
So we would like to keep using current material.

(PM) Sheila Tu

2021-10-21 21:57

developer   ~0008540

Hi Mr. Yoon,

OK, we respect your decision.
Please also help to comment your conclusion in DFM file (https://mantis.cnsbg.foxconn.com/vaas/view.php?id=1131#c8459). Thank you.

(ALTech) SH Son

2022-01-03 09:22

developer   ~0009187

fixed MIC sealing conditions for MP.
closed this ticket, if needed change MIC sealing solution, please make the new mantis ticket.

Thanks
SON

Issue History

Date Modified Username Field Change
2021-03-23 17:11 (ALTech) SH Son New Issue
2021-03-23 17:11 (ALTech) SH Son Issue Monitored: (ALTech) BY Lee
2021-03-23 17:11 (ALTech) SH Son Issue Monitored: (ALTech) JW Kim
2021-03-23 17:11 (ALTech) SH Son Issue Monitored: (ALTech) Lonnie Kim
2021-03-23 17:11 (ALTech) SH Son Issue Monitored: (ALTech) Philip
2021-03-23 17:11 (ALTech) SH Son Issue Monitored: (ALTech) SB Park
2021-03-23 17:11 (ALTech) SH Son Issue Monitored: (ALTech) SH Son
2021-03-23 17:11 (ALTech) SH Son Issue Monitored: (ALTech) SY Yoon
2021-03-23 17:11 (ALTech) SH Son Issue Monitored: (HW) Catherine Chen
2021-03-23 17:11 (ALTech) SH Son Issue Monitored: (HW) Sean Chiang
2021-03-23 17:11 (ALTech) SH Son Issue Monitored: (HW) Tom Lee
2021-03-23 17:11 (ALTech) SH Son Issue Monitored: (ME) Daniel Hu
2021-03-23 17:11 (ALTech) SH Son Issue Monitored: (PM) Henry Chiou
2021-03-23 17:11 (ALTech) SH Son Issue Monitored: (PM) Tiffanie Lai
2021-03-23 17:11 (ALTech) SH Son Issue Monitored: (RD) Fu-chiang Young
2021-03-23 17:11 (ALTech) SH Son Issue Monitored: (RD) Jay Lin
2021-03-23 17:11 (ALTech) SH Son Issue Monitored: (RD) Jim Chen
2021-03-23 17:12 (ALTech) SH Son File Added: Swan_soundbar_DVT_MIC_sesaling test_210323.pptx
2021-03-23 17:12 (ALTech) SH Son Note Added: 0006487
2021-03-23 17:12 (ALTech) SH Son Assigned To => (HW) Sean Chiang
2021-03-23 17:12 (ALTech) SH Son Status new => assigned
2021-03-24 10:05 (ALTech) SH Son File Added: BFX_UA300_MIC sealing test_20210309.pdf
2021-03-24 10:05 (ALTech) SH Son File Added: MIC sealing-20210310.pptx.pptx
2021-03-24 10:05 (ALTech) SH Son File Added: RE_ _SWAN_DVT Test plan.msg
2021-03-24 10:05 (ALTech) SH Son Note Added: 0006495
2021-04-01 15:02 (ALTech) SH Son File Added: RE_ _SWAN_ MIC soldering defect.msg
2021-04-01 15:02 (ALTech) SH Son File Added: BFX_UA300_MIC sealing test_20210326.pdf
2021-04-01 15:02 (ALTech) SH Son File Added: MIC sealing-20210330-V1_ME.pdf
2021-04-01 15:02 (ALTech) SH Son Note Added: 0006553
2021-04-02 16:55 (ALTech) SH Son File Added: Swan_soundbar_DVT_MIC_sesaling test_210329_v3.pdf
2021-04-02 16:55 (ALTech) SH Son Note Added: 0006561
2021-04-06 15:02 (RD) Fu-chiang Young Note Added: 0006579
2021-04-06 15:13 (RD) Fu-chiang Young Note View State: 0006579: private
2021-04-06 15:13 (RD) Fu-chiang Young Note Edited: 0006579
2021-04-07 19:48 (RD) Fu-chiang Young File Added: MIC sealing test environment-20210326.pdf
2021-04-07 19:48 (RD) Fu-chiang Young Note Added: 0006621
2021-04-08 10:56 (HW) Sean Chiang Note Edited: 0006621
2021-04-13 10:39 (RD) Fu-chiang Young Note Added: 0006676
2021-04-20 10:18 (ALTech) SH Son Note Added: 0006772
2021-04-28 14:43 (RD) Fu-chiang Young Note Added: 0006912
2021-04-28 14:47 (RD) Fu-chiang Young Note View State: 0006912: private
2021-04-28 14:48 (RD) Fu-chiang Young Note Added: 0006913
2021-04-28 14:48 (RD) Fu-chiang Young Note Edited: 0006912
2021-04-29 14:19 (RD) Fu-chiang Young File Added: BFX_UA300_MIC sealing test_20210429.pdf
2021-04-29 14:19 (RD) Fu-chiang Young Note Added: 0006945
2021-04-30 19:57 (RD) Fu-chiang Young Note Added: 0006966
2021-04-30 19:57 (RD) Fu-chiang Young Note View State: 0006966: private
2021-04-30 19:58 (RD) Fu-chiang Young Note Edited: 0006966
2021-04-30 19:58 (RD) Fu-chiang Young Note Added: 0006967
2021-05-20 09:48 (ALTech) SH Son Note Added: 0007176
2021-05-20 10:22 (RD) Fu-chiang Young Note Added: 0007178
2021-05-21 11:14 (RD) Fu-chiang Young File Added: 93010LE, 93015LE, 93020LE 材质报告(1).pdf
2021-05-21 11:14 (RD) Fu-chiang Young Note Added: 0007198
2021-05-24 10:47 (ALTech) SH Son File Added: Swan_soundbar_DVT_MIC_sesaling test_210521_v1.pdf
2021-05-24 10:47 (ALTech) SH Son Note Added: 0007210
2021-05-25 12:56 (HW) Sean Chiang Note Added: 0007221
2021-05-25 14:49 (ALTech) SH Son File Added: DUBBLE TAPE_SPONGE MIC_210521.dwg
2021-05-25 14:49 (ALTech) SH Son Note Added: 0007222
2021-05-25 14:50 (ALTech) SH Son Note Edited: 0007222
2021-05-25 18:30 (HW) Sean Chiang Note Added: 0007225
2021-06-08 16:42 (HW) Sean Chiang Note Added: 0007396
2021-06-14 16:06 (ALTech) SH Son Note Added: 0007457
2021-06-24 10:58 (ALTech) SH Son File Added: Swan_soundbar_DVT_MIC_sesaling test_210622_v1.pdf
2021-06-24 10:58 (ALTech) SH Son Note Added: 0007547
2021-06-24 11:34 (HW) Sean Chiang Note Added: 0007548
2021-06-24 14:41 (ALTech) SH Son File Added: FedEx Ship Manager - 라벨 인쇄_210624_fii rubber.pdf
2021-06-24 14:41 (ALTech) SH Son Note Added: 0007549
2021-09-27 16:28 (ALTech) SH Son Issue Monitored: (PM) Sheila Tu
2021-09-27 16:28 (ALTech) SH Son Note Added: 0008308
2021-10-12 20:04 (PM) Sheila Tu Note Added: 0008423
2021-10-13 10:08 (ALTech) SH Son Note Added: 0008426
2021-10-13 11:00 (PM) Sheila Tu File Added: adhesive_double.pdf
2021-10-13 11:00 (PM) Sheila Tu Note Added: 0008433
2021-10-20 15:26 (ALTech) SH Son Note Added: 0008509
2021-10-20 17:54 (PM) Sheila Tu Note Added: 0008515
2021-10-21 11:00 (ALTech) SY Yoon Note Added: 0008524
2021-10-21 12:10 (PM) Sheila Tu File Added: WeChat 圖片_20211021114629.jpg
2021-10-21 12:10 (PM) Sheila Tu Note Added: 0008527
2021-10-21 15:05 (ALTech) SY Yoon Note Added: 0008532
2021-10-21 21:57 (PM) Sheila Tu Note Added: 0008540
2021-12-28 22:09 (HW) Sean Chiang Status assigned => resolved
2021-12-28 22:09 (HW) Sean Chiang Resolution open => fixed
2021-12-28 22:09 (HW) Sean Chiang Severity s2-severe => s4-minor
2022-01-03 09:22 (ALTech) SH Son Status resolved => closed
2022-01-03 09:22 (ALTech) SH Son Note Added: 0009187