View Issue Details
| ID | Project | Category | View Status | Date Submitted | Last Update |
|---|---|---|---|---|---|
| 0001177 | K18X001.00 SKB SWAN | HW | public | 2021-03-23 17:11 | 2022-01-03 09:22 |
| Reporter | (ALTech) SH Son | Assigned To | (HW) Sean Chiang | Due Date | |
| Priority | normal | Severity | s4-minor | Reproducibility | have not tried |
| Status | closed | Resolution | fixed | ||
| Summary | 0001177: [SWAN] MIC Sealing test | ||||
| Description | need to update Mic sealing condition and find the Mic sealing condition for meet the customer spec. | ||||
| Tags | No tags attached. | ||||
| Attach Tags | |||||
| User List |
(ALTech) BY Lee , (ALTech) JW Kim , (ALTech) Lonnie Kim , (ALTech) Philip , |
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Korea (Inkel) lab test result |
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Fii test report upload |
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Fii additional test report updated. |
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3/29 Korea lab test result |
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Hi SH, Update the test environment as attached file. Thank you. |
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Hi SH, Will provide new sponge_mic_silicon rubber 1.1t without pcb side o-ring for us to test? When is ETA? For DVT3, the label of mic board has been changed and components need to move. Also will provide latest version silicon_mic rubber for us to test on DVT3 build? Thank you. |
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HI Fu-chiang Young 0001177:0006676 for DVT3 sponge_mic_silicon rubber : 1.1t without pcb side o-ring and DVT3 silicon Mic : as Fii designed is being delivered. Please test and verify. about components move DVT3 Mic due to label, I want to use it without modification DVT3 silicon Mic in DVT. if you have any question, please let me know Thanks SON |
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Hi SH, We received the rubber yesterday(4/27), and will arrange to test on Tuesday(4/29). For silicon_mic rubber, will that use non-modification for DVT3? Let's test and see the test results. Thank you. |
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Hi SH, We test the new rubber, but the test results are fail. Please see the attached report. By the way, how about the test result last time Henry sent you the golden top cover? Thank you. |
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Hi SH, As our internal discussion, we might hope to see the test results for DVT3 new rubber solution which were as sent to us. And also help to verify the golden top cover. We found our test environment has a little bit different as your environment. Maybe the sweep source needs to put at the edge of the desk for reduce the reflection and move test sample closer to sweep source to make sure with 94dBSPL. Thank you. |
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Hi Fu-chiang Young reply 0001177:0006967 I know the a little bit different as your environment. and checked same trend FII test result and ALT test result DVT3 rubber and Fii golden top cover 0001177:0006945 So, will prepare same conditions Fii golden top cover questions. 1. checked the golden top cover conditions a. sponge mic silicon : 0.5t thickness : double side O-ring ? or one side(top houding side) O-ring? The O-ring did not significantly affect the results. I think top houding side O-ring seems to have better tape adhesion. b. adhesive tape : 0.2t thickness c. silicon Mic : add 0.9mm back side 2. update the technical datasheet adhesive tape : I will discuss with Inkel to assembled adhesive tape to sponge mic silicon Thanks SON |
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Hi SH, Update the information: questions. 1. checked the golden top cover conditions a. sponge mic silicon : 0.5t thickness : double side O-ring ? or one side(top houding side) O-ring? Fuchiang: It is double side O-ring, the hole of the adhesive is smaller than O-ring. The O-ring did not significantly affect the results. I think top houding side O-ring seems to have better tape adhesion. b. adhesive tape : 0.2t thickness c. silicon Mic : add 0.9mm back side Fuchiang: Yes, b and c points are correct. In our testing, O-ring can be cancelled on PCB side. Mic vendor suggests us to paste the adhesive on PCB side can provide more sealing. Because the PCB has many via and the PCB is not smooth. The adhesive may be a good solution for sealing. 2. update the technical datasheet adhesive tape : I will discuss with Inkel to assembled adhesive tape to sponge mic silicon Fuchiang: ME has no datasheet currently. The adhesive is 3M and thickness is 0.2mm. Thank you. |
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Hi SH, Update the 3M adhesive datasheet. Thank you. |
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HI Sean. Here is Korea lab test result updated. and about Adhesive tape between PCBA and housing • Fii need to review that Adhesive tape apply on the MIC PCBA please see the attached test report. Thanks SON |
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Hi SH, Please see my comment about the next plan of your report. Thanks! 1. About the rubber design, Fii verified the double-sided O-ring in DVT stage because we only received double-sided sample at that time. Although the result is good but we think the single-sided is more suitable for assembly between PCB and rubber. Can you also make a single-sided o-ring rubber sample for further verification? 2. About the adhesive tape between PCBA and rubber, ME Jim will evaluate that with factory engineer and get back to you by this Thursday. Regards, Sean |
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HI Sean 0001177:0007221 1. Let me know final FII request O-ring design within today. as my test result, the O ring (double side or single side) does not have a significant effect on the results. I think single side O ring(housing side) is enough to FII's "sponge mic silicon" design purpose. we have to consider attached adhesive and assembly. 2. Please find the adhesive tape design from Inkel ME. Thank SON |
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Hi SH, 1. OK. I agreed with you. Please prepare single-sided sponge_silicon_MIC for us. 2. Got it. We will check it. Thanks, Regards, Sean |
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Hi SH, We have asked two vendors to prepare adhesive tape samples for us. One of vendor called MeiGaoMei that has sent out 40pcs samples to you yesterday. Please refer the tracking number as below, Will provide you another track number once we get the infomation from vendor. Thanks! Vendor name: MeiGao Mei, Track number: SF1123316896372 (Express: SF EXPRESS) Regards, Sean |
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Hi Sean and Jim I received adhesive tape samples. - MeiGaoMei , shenzhen everything industrial Both adhesive tapes are little bit larger than the MIC PCBA, but assembly is not a problem. I checked the top housing assembly, will be no problem. but, the adhesive tape should be attached MIC PCBA side first. - Please confirm the adhesive tapes sub assembly proceed at VN factory. I will update the MIC sealing performance result. Thanks SON |
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Hi Sean Here is new rubber test report at korea lab the result is pass. Please refer to the attachment report Thanks SON |
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Hi SH, Thanks for the report. Can you confirm that the MIC Silicon rubber you are testing is double-sided or single-sided o-ring? Thanks, Regards, Sean |
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Hi Sean I tested single-sided o-ring. and the rubber sample send to FII today Fedex : 7740 8555 8444 The other rubber sample will send with T1 housing sample Thanks SON |
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Hi Sean Please let us know the below vender contact point and MPN. MeiGaoMei , shenzhen everything industrial ALT is under review the adhesive tape order directly, Please let me know if you have any problems. Thanks SON |
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Hi SH, I've explained in weekly meeting that our RD doesn't have the vendor's contact information because these kinds of materials are controlled by our purchase team. After the discussion with our purchase team, they refuse to provide the information because the contact window on vendor site for ALT won't be the same as Fii's. As an alternative plan, please refer to the attached drawing and the below link. You could find their official contact information on their website. MeiGaoMei : http://www.meigaom.com/home.html shenzhen everything industrial: https://www.eti-print.com/ |
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Hi Sheila Tu the drawings is missing. before contact the vender, I dont know final drawing and MPN. Please upload the final drawings and MPN Thanks SON |
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Hi SH, Sorry to miss the drawing. Please find the attachment. * There is no MPN in this material because it's customized material by Fii. You could use the drawing to check with vendors. |
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Sheila Tu 0001177:0008433 IF ALT is order the adhesive tape directly, How do I send it to the factory? please let us know the FII PN also, It is a material that must be used in the next production. Can you check the factory the stock status? Thanks SON |
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Hi SH, Our RD did apply P/N in adavance. Fii P/N: 481.00620.005LT So far we have 7.4K in stock and 4.6K OPO that the vendor doesn't agree to cancel. If ALT agrees to assembly it then ship it out to Fii, we could change the material by running change to prevent idle material. |
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Hi Ms. Sheila Tu, We were trying to find another solution instead of "double side acetic tape" for MIC sealing. As you know, double side acetic tape cannot attach on Sponge_mic_Silicon. So we would like to remove and change thickness of Sponge_Mic_Silicon. But test result was fail. So we should keep using "double side acetic tape" for mic sealing. If you have any concern to keep using "double side acetic tape", please let us know. |
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Hi Mr. Yoon, The purpose of "double side acetic tape" is to prevent interstice between PCBA and Sponge_mic_Silicon. We think you could refer to the adhesive on 4000-21105-500-0V instead of "double side acetic tape". I attached the picture for your reference. |
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Hi Ms. Sheila Tu, We tried to attach Sponge_Mic_Silicon on Rubber foot adhesive tape. Sponge_Mic_Silicon cannot be attached on Rubber foot. It is same situation that "double side acetic tape" cannot attach on Sponge_Mic_Silicon. I think you can try. And if we changed the material for sealing, then we arrange the test Lab that SKT designated. Test cost is more higher than cost of 10K pcs of double side acetic tape. It is not included our labor cost. So we would like to keep using current material. |
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Hi Mr. Yoon, OK, we respect your decision. Please also help to comment your conclusion in DFM file (https://mantis.cnsbg.foxconn.com/vaas/view.php?id=1131#c8459). Thank you. |
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fixed MIC sealing conditions for MP. closed this ticket, if needed change MIC sealing solution, please make the new mantis ticket. Thanks SON |
| Date Modified | Username | Field | Change |
|---|---|---|---|
| 2021-03-23 17:11 | (ALTech) SH Son | New Issue | |
| 2021-03-23 17:11 | (ALTech) SH Son | Issue Monitored: (ALTech) BY Lee | |
| 2021-03-23 17:11 | (ALTech) SH Son | Issue Monitored: (ALTech) JW Kim | |
| 2021-03-23 17:11 | (ALTech) SH Son | Issue Monitored: (ALTech) Lonnie Kim | |
| 2021-03-23 17:11 | (ALTech) SH Son | Issue Monitored: (ALTech) Philip | |
| 2021-03-23 17:11 | (ALTech) SH Son | Issue Monitored: (ALTech) SB Park | |
| 2021-03-23 17:11 | (ALTech) SH Son | Issue Monitored: (ALTech) SH Son | |
| 2021-03-23 17:11 | (ALTech) SH Son | Issue Monitored: (ALTech) SY Yoon | |
| 2021-03-23 17:11 | (ALTech) SH Son | Issue Monitored: (HW) Catherine Chen | |
| 2021-03-23 17:11 | (ALTech) SH Son | Issue Monitored: (HW) Sean Chiang | |
| 2021-03-23 17:11 | (ALTech) SH Son | Issue Monitored: (HW) Tom Lee | |
| 2021-03-23 17:11 | (ALTech) SH Son | Issue Monitored: (ME) Daniel Hu | |
| 2021-03-23 17:11 | (ALTech) SH Son | Issue Monitored: (PM) Henry Chiou | |
| 2021-03-23 17:11 | (ALTech) SH Son | Issue Monitored: (PM) Tiffanie Lai | |
| 2021-03-23 17:11 | (ALTech) SH Son | Issue Monitored: (RD) Fu-chiang Young | |
| 2021-03-23 17:11 | (ALTech) SH Son | Issue Monitored: (RD) Jay Lin | |
| 2021-03-23 17:11 | (ALTech) SH Son | Issue Monitored: (RD) Jim Chen | |
| 2021-03-23 17:12 | (ALTech) SH Son | File Added: Swan_soundbar_DVT_MIC_sesaling test_210323.pptx | |
| 2021-03-23 17:12 | (ALTech) SH Son | Note Added: 0006487 | |
| 2021-03-23 17:12 | (ALTech) SH Son | Assigned To | => (HW) Sean Chiang |
| 2021-03-23 17:12 | (ALTech) SH Son | Status | new => assigned |
| 2021-03-24 10:05 | (ALTech) SH Son | File Added: BFX_UA300_MIC sealing test_20210309.pdf | |
| 2021-03-24 10:05 | (ALTech) SH Son | File Added: MIC sealing-20210310.pptx.pptx | |
| 2021-03-24 10:05 | (ALTech) SH Son | File Added: RE_ _SWAN_DVT Test plan.msg | |
| 2021-03-24 10:05 | (ALTech) SH Son | Note Added: 0006495 | |
| 2021-04-01 15:02 | (ALTech) SH Son | File Added: RE_ _SWAN_ MIC soldering defect.msg | |
| 2021-04-01 15:02 | (ALTech) SH Son | File Added: BFX_UA300_MIC sealing test_20210326.pdf | |
| 2021-04-01 15:02 | (ALTech) SH Son | File Added: MIC sealing-20210330-V1_ME.pdf | |
| 2021-04-01 15:02 | (ALTech) SH Son | Note Added: 0006553 | |
| 2021-04-02 16:55 | (ALTech) SH Son | File Added: Swan_soundbar_DVT_MIC_sesaling test_210329_v3.pdf | |
| 2021-04-02 16:55 | (ALTech) SH Son | Note Added: 0006561 | |
| 2021-04-06 15:02 |
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Note Added: 0006579 | |
| 2021-04-06 15:13 |
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Note View State: 0006579: private | |
| 2021-04-06 15:13 |
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Note Edited: 0006579 | |
| 2021-04-07 19:48 |
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File Added: MIC sealing test environment-20210326.pdf | |
| 2021-04-07 19:48 |
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Note Added: 0006621 | |
| 2021-04-08 10:56 | (HW) Sean Chiang | Note Edited: 0006621 | |
| 2021-04-13 10:39 |
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Note Added: 0006676 | |
| 2021-04-20 10:18 | (ALTech) SH Son | Note Added: 0006772 | |
| 2021-04-28 14:43 |
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Note Added: 0006912 | |
| 2021-04-28 14:47 |
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Note View State: 0006912: private | |
| 2021-04-28 14:48 |
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Note Added: 0006913 | |
| 2021-04-28 14:48 |
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Note Edited: 0006912 | |
| 2021-04-29 14:19 |
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File Added: BFX_UA300_MIC sealing test_20210429.pdf | |
| 2021-04-29 14:19 |
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Note Added: 0006945 | |
| 2021-04-30 19:57 |
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Note Added: 0006966 | |
| 2021-04-30 19:57 |
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Note View State: 0006966: private | |
| 2021-04-30 19:58 |
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Note Edited: 0006966 | |
| 2021-04-30 19:58 |
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Note Added: 0006967 | |
| 2021-05-20 09:48 | (ALTech) SH Son | Note Added: 0007176 | |
| 2021-05-20 10:22 |
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Note Added: 0007178 | |
| 2021-05-21 11:14 |
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File Added: 93010LE, 93015LE, 93020LE 材质报告(1).pdf | |
| 2021-05-21 11:14 |
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Note Added: 0007198 | |
| 2021-05-24 10:47 | (ALTech) SH Son | File Added: Swan_soundbar_DVT_MIC_sesaling test_210521_v1.pdf | |
| 2021-05-24 10:47 | (ALTech) SH Son | Note Added: 0007210 | |
| 2021-05-25 12:56 | (HW) Sean Chiang | Note Added: 0007221 | |
| 2021-05-25 14:49 | (ALTech) SH Son | File Added: DUBBLE TAPE_SPONGE MIC_210521.dwg | |
| 2021-05-25 14:49 | (ALTech) SH Son | Note Added: 0007222 | |
| 2021-05-25 14:50 | (ALTech) SH Son | Note Edited: 0007222 | |
| 2021-05-25 18:30 | (HW) Sean Chiang | Note Added: 0007225 | |
| 2021-06-08 16:42 | (HW) Sean Chiang | Note Added: 0007396 | |
| 2021-06-14 16:06 | (ALTech) SH Son | Note Added: 0007457 | |
| 2021-06-24 10:58 | (ALTech) SH Son | File Added: Swan_soundbar_DVT_MIC_sesaling test_210622_v1.pdf | |
| 2021-06-24 10:58 | (ALTech) SH Son | Note Added: 0007547 | |
| 2021-06-24 11:34 | (HW) Sean Chiang | Note Added: 0007548 | |
| 2021-06-24 14:41 | (ALTech) SH Son | File Added: FedEx Ship Manager - 라벨 인쇄_210624_fii rubber.pdf | |
| 2021-06-24 14:41 | (ALTech) SH Son | Note Added: 0007549 | |
| 2021-09-27 16:28 | (ALTech) SH Son | Issue Monitored: (PM) Sheila Tu | |
| 2021-09-27 16:28 | (ALTech) SH Son | Note Added: 0008308 | |
| 2021-10-12 20:04 | (PM) Sheila Tu | Note Added: 0008423 | |
| 2021-10-13 10:08 | (ALTech) SH Son | Note Added: 0008426 | |
| 2021-10-13 11:00 | (PM) Sheila Tu | File Added: adhesive_double.pdf | |
| 2021-10-13 11:00 | (PM) Sheila Tu | Note Added: 0008433 | |
| 2021-10-20 15:26 | (ALTech) SH Son | Note Added: 0008509 | |
| 2021-10-20 17:54 | (PM) Sheila Tu | Note Added: 0008515 | |
| 2021-10-21 11:00 | (ALTech) SY Yoon | Note Added: 0008524 | |
| 2021-10-21 12:10 | (PM) Sheila Tu | File Added: WeChat 圖片_20211021114629.jpg | |
| 2021-10-21 12:10 | (PM) Sheila Tu | Note Added: 0008527 | |
| 2021-10-21 15:05 | (ALTech) SY Yoon | Note Added: 0008532 | |
| 2021-10-21 21:57 | (PM) Sheila Tu | Note Added: 0008540 | |
| 2021-12-28 22:09 | (HW) Sean Chiang | Status | assigned => resolved |
| 2021-12-28 22:09 | (HW) Sean Chiang | Resolution | open => fixed |
| 2021-12-28 22:09 | (HW) Sean Chiang | Severity | s2-severe => s4-minor |
| 2022-01-03 09:22 | (ALTech) SH Son | Status | resolved => closed |
| 2022-01-03 09:22 | (ALTech) SH Son | Note Added: 0009187 |